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i. ApplicationDiffusion bonding is the most technically difficult among various bonding methods.
It is employed for the production of sputtering targets used in the semiconductor process, which requires high working temperatures.
It does not involve any liquid fusion as with solder bonding and brazing.
Diffusion bonding is performed by assembling a target and a backing plate together and then exerting both high temperature and high pressure.
Since the target and the backing plate are joined by atomic diffusion, diffusion bonding is the most advantageous bonding method in terms of the bonding ratio and the thermal conduction
ii. ImplementationApplied Science Corporation has profound know-how and experiences with diffusion bonding.
We have supplied our diffusion-bonded sputtering targets to many semiconductor manufacturers and received high recognition for the quality of our products
Ultrasonic Scanning of Diffusion Bonded Interface of our Ti Target
Bonding ratioe: 100%